Heat staking application for fixing a circuit board in a plastic body
Heat staking application for fixing a circuit board in a plastic body.
The circuit board is located in an injection moulding part with prepared parts.
The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.
Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.
