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Application 13

Soldering of single stranded wires on a metallic support with applied printing in thick-film technology.

Use of a profiled soldering bar for the optimal positioning of the stranded wires to the soldering pads and for an improved heat input compared to a flat soldering bar.

The profiling of the soldering bar is product-specific and, therefore, can be adapted to the respective wire cross section.

There is an open choice of the number of profilings.

Profilings can be of different shapes and sizes. Thus conductors with different cross sections can be soldered in just one process step.

Hot Bar Soldering - Application 13
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Application 27

Soldering of a flex foil on a PCB.

Hot Bar Soldering with flat soldering bar.

Hot Bar Soldering - Application 27
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Application 28

Soldering of a ribbon cable on an aluminium oxide PCB.

Use of a profiled soldering bar for the optimal positioning of the stranded wires to the soldering pads and for an improved heat input compared to a flat soldering bar.

The profiling of the soldering bar is product-specific and, therefore, can be adapted to the respective wire cross section. There is an open choice of the number of profilings.

Profilings can be of different shapes and sizes. Thus conductors with different cross sections can be soldered in just one process step.

Hot Bar Soldering - Application 28
Product Images
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  • Application 28Application 28
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Application 30

Soldering of a ribbon cable on a PCB.

Use of a profiled soldering bar for the optimal positioning of the stranded wires to the soldering pads and for an improved heat input compared to a flat soldering bar.

The profiling of the soldering bar is product-specific and, therefore, can be adapted to the respective wire cross section. There is an open choice of the number of profilings.

Profilings can be of different shapes and sizes.

Thus conductors with different cross sections can be soldered in just one process step.

Hot Bar Soldering - Application 30
Product Images
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  • Application 30Application 30
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Beispiel
Application 26
Application 27
Application 28
Application 30

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