Unfilled frame of plastic heat staked for fixing a printed circuit board. Dom diameter approx 3.6mm. Material PC

Heat staking application for fixing an LCD display in a plastic body.

Two shaped heating dies are moved to plastic edges and formed on the product.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.