Deutsch
English

Application 20

Fixing a transparent plastic lid on a bottom part, material is PMMA. The dome measuring about 4 mm in diameter.

Heat Staking - Application 20
Product Images
  • Application 20Application 20
  • Application 20Application 20
  • Application 20Application 20

Application 1

Heat staking application for fixing an LCD display in a plastic body.

Two shaped heating dies are moved to plastic edges and formed on the product.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 1
Product Images
  • Application 1Application 1
  • Application 1Application 1
  • Application 1Application 1

Application 2

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 2
Product Images
  • Application 2Application 2
  • Application 2Application 2
  • Application 2Application 2

Application 3

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 3
Product Images
  • Application 3Application 3
  • Application 3Application 3
  • Application 3Application 3

Application 4

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 4
Product Images
  • Application 4Application 4
  • Application 4Application 4
  • Application 4Application 4

Application 5

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 5
Product Images
  • Application 5Application 5
  • Application 5Application 5
  • Application 5Application 5
Application 1
Application 2
Application 3
Application 4
Application 5
Beispiel

5 / 21

Applications Overview