Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Fixing a transparent plastic lid on a bottom part, material is PMMA. The dome measuring about 4 mm in diameter.

Plastic pins are formed on a circuit board to fix it permanently to the plastic body. Pin diameter approx 1.4mm, the Dom measures 2.5mm.

A metal sheet is fixed by the heat staking process at several positions in a plastic housing. The plastic is standard unfilled plastic (ABS). The dome measuring about 2 mm in diameter.

In total 8 approximately 3 mm measuring pins, a lid is placed and fixed by heat staking. The Dome measured in the unformed state approximately 6mm in diameter. Material: PA

Plastic Domes fix a circuit board in a plastic component. Material PA6-GF30. Dom diameter about 3,2mm.