Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Classic Plastic PCB heat staking application. Fixing a circuit board in a plastic body, a total of 10 pins with a diameter of 2.1 mm are formed in one single step to domes of 3.7mm. Material PA6-GF3

Staking a shielding plate in a plastic housing(PP-T20). The Dome measure approximately 3.6 mm in diameter.

Plastic-plastic heat staking application. Permanent connection of two mating parts. Dom diameter about 2.9 mm. Material PBT-GF20

Unfilled frame of plastic heat staked for fixing a printed circuit board. Dom diameter approx 3.6mm. Material PC

The connection pins of the electronic component are fixed mechanically by staking of the U-shaped elements in oval domes. Material PBT-GF20