Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Classical pin to dom application. Pin diameter before staking around 2,9mnm, Dom about 4.8mm.
Material: PEI

In order to fix a circuit board on a plastic body several pins are reshaped to doms. The pins measure before staking 1.6mm, dome measuring 2.6mm. The material is a PA6-GF20

A greater number of metal plates are fixed in only one single heat staking process. The pins measure approximately 1.3mm, the dome about 2.2mm. The material is a PA6-GF3

Forming of multiple pins with a diameter of 0.8mm to 1.5mm domes. Fixing a plastic cover on a support frame. Plastic: PP